線路板流程術(shù)語中英文對照

流程簡介：開料－－鉆孔－－干膜制程－－壓合－－減銅－－電鍍－－塞孔－－防焊(綠漆/綠油)

????????? －－鍍金－－噴錫－－成型－－開短路測試－－終檢－－雷射鉆孔

A. 開料( Cut Lamination)

a-1 裁板( Sheets Cutting)

a-2 原物料發(fā)料(Panel)(Shear material to Size)

B. 鉆孔(Drilling)

b-1 內(nèi)鉆(Inner Layer Drilling )

b-2 一次孔(Outer Layer Drilling )

b-3 二次孔(2nd Drilling)

b-4 雷射鉆孔(Laser Drilling )(Laser Ablation )

b-5 盲(埋)孔鉆孔(Blind & Buried Hole Drilling)

C. 干膜制程( Photo Process(D/F))

c-1 前處理(Pretreatment)

c-2 壓膜(Dry Film Lamination)

c-3 曝光(Exposure)

c-4 顯影(Developing)

c-5 蝕銅(Etching)

c-6 去膜(Stripping)

c-7 初檢( Touch-up)

c-8 化學(xué)前處理,化學(xué)研磨( Chemical Milling )

c-9 選擇性浸金壓膜(Selective Gold Dry Film Lamination)

c-10 顯影(Developing )

c-11 去膜(Stripping )

Developing , Etching & Stripping ( DES )

D. 壓合Lamination

d-1 黑化(Black Oxide Treatment)

d-2 微蝕(Microetching)

d-3 鉚釘組合(eyelet )

d-4 疊板(Lay up)

d-5 壓合(Lamination)

d-6 后處理(Post Treatment)

d-7 黑氧化( Black Oxide Removal )

d-8 銑靶(spot face)

d-9 去溢膠(resin flush removal)

E. 減銅(Copper Reduction)

e-1 薄化銅(Copper Reduction)

F. 電鍍(Horizontal Electrolytic Plating)

f-1 水平電鍍(Horizontal Electro-Plating) (Panel Plating)

f-2 錫鉛電鍍( Tin-Lead Plating ) (Pattern Plating)

f-3 低于1 mil ( Less than 1 mil Thickness )

f-4 高于1 mil ( More than 1 mil Thickness)

f-5 砂帶研磨(Belt Sanding)

f-6 剝錫鉛( Tin-Lead Stripping)

f-7 微切片( Microsection)

G. 塞孔(Plug Hole)

g-1 印刷( Ink Print )

g-2 預(yù)烤(Precure)

g-3 表面刷磨(Scrub)

g-4 后烘烤(Postcure)

H. 防焊(綠漆/綠油): (Solder Mask)

h-1 C面印刷(Printing Top Side)

h-2 S面印刷(Printing Bottom Side)

h-3 靜電噴涂(Spray Coating)

h-4 前處理(Pretreatment)

h-5 預(yù)烤(Precure)

h-6 曝光(Exposure)

h-7 顯影(Develop)

h-8 后烘烤(Postcure)

h-9 UV烘烤(UV Cure)

h-10 文字印刷( Printing of Legend )

h-11 噴砂( Pumice)(Wet Blasting)

h-12 印可剝離防焊(Peelable Solder Mask)

I . 鍍金Gold plating

i-1 金手指鍍鎳金( Gold Finger )

i-2 電鍍軟金(Soft Ni/Au Plating)

i-3 浸鎳金( Immersion Ni/Au) (Electroless Ni/Au)

J. 噴錫(Hot Air Solder Leveling)

j-1 水平噴錫(Horizontal Hot Air Solder Leveling)

j-2 垂直噴錫( Vertical Hot Air Solder Leveling)

j-3 超級焊錫(Super Solder )

j-4. 印焊錫突點(Solder Bump)

K. 成型(Profile)(Form)

k-1 撈型(N/C Routing ) (Milling)

k-2 模具沖(Punch)

k-3 板面清洗烘烤(Cleaning & Backing)

k-4 V型槽( V-Cut)(V-Scoring)

k-5 金手指斜邊( Beveling of G/F)

L. 開短路測試(Electrical Testing) (Continuity & Insulation Testing)

l-1 AOI 光學(xué)檢查( AOI Inspection)

l-2 VRS 目檢(Verified & Repaired)

l-3 泛用型治具測試(Universal Tester)

l-4 專用治具測試(Dedicated Tester)

l-5 飛針測試(Flying Probe)

M. 終檢( Final Visual Inspection)

m-1 壓板翹( Warpage Remove)

m-2 X-OUT 印刷(X-Out Marking)

m-3 包裝及出貨(Packing & shipping)

m-4 目檢( Visual Inspection)

m-5 清洗及烘烤( Final Clean & Baking)

m-6 護銅劑(ENTEK Cu-106A)(OSP)

m-7 離子殘余量測試(Ionic Contamination Test )(Cleanliness Test)

m-8 冷熱沖擊試驗(Thermal cycling Testing)

m-9 焊錫性試驗( Solderability Testing )

N. 雷射鉆孔(Laser Ablation)

N-1 雷射鉆Tooling孔(Laser ablation Tooling Hole)

N-2 雷射曝光對位孔(Laser Ablation Registration Hole)

N-3 雷射Mask制作(Laser Mask)

N-4 雷射鉆孔(Laser Ablation)

N-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired)

N-6 Blaser AOI (after Desmear and Microetching)

N-7 除膠渣(Desmear)

N-8 微蝕(Microetching )