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TMS320DM365 DaVinci 數(shù)字媒體處理器

數(shù)據(jù):

描述

開發(fā)人員現(xiàn)在可以在數(shù)字視頻設(shè)計中以30fps的速度提供高達(dá)720p H.264的像素完美圖像,而無需考慮視頻格式支持,網(wǎng)絡(luò)帶寬受限新型TMS320DM365數(shù)字媒體處理器基于德州儀器(TI)的DaVinci技術(shù),有限的系統(tǒng)存儲容量或成本。憑借多格式高清視頻,DM365還具有一套外設(shè),可為開發(fā)人員節(jié)省系統(tǒng)成本。

這款基于ARM9的DM365設(shè)備提供高達(dá)300 MHz的速度,并支持符合生產(chǎn)要求的H.264,MPEG -4,MPEG-2,MJPEG和VC1 /WMV9編解碼器,使客戶能夠靈活地為其應(yīng)用選擇正確的視頻編解碼器。這些編解碼器由視頻加速器驅(qū)動,從ARM內(nèi)核卸載壓縮需求,以便開發(fā)人員可以利用ARM的最高性能來實現(xiàn)其應(yīng)用。視頻監(jiān)控設(shè)計人員可以實現(xiàn)更高的壓縮效率,從而在不影響網(wǎng)絡(luò)帶寬的情媒體播放和相機驅(qū)動應(yīng)用的開發(fā)人員,如視頻門鈴,數(shù)字標(biāo)牌,數(shù)字視頻錄像機,便攜式媒體播放器等,可以利用DM365支持的全套編解碼器,確保互操作性和產(chǎn)品可擴展性。 /p>

與多格式高清視頻一起,DM365可實現(xiàn)與視頻應(yīng)用所需的大多數(shù)其他外部設(shè)備的無縫接口。圖像傳感器接口足夠靈活,可支持CCD,CMOS和各種其他接口,如BT.656,BT1120。 DM365還提供高清集成,支持高清顯示,包括3個內(nèi)置10位高清模擬視頻數(shù)模轉(zhuǎn)換器(DAC),DDR2 /mDDR,以太網(wǎng)MAC,USB 2.0,集成音頻,主機端口接口( HPI),模數(shù)轉(zhuǎn)換器以及更多功能可以為開發(fā)人員節(jié)省整體系統(tǒng)成本以及電路板上的空間,從而實現(xiàn)更纖薄,更時尚的設(shè)計。

特性

  • Highlights
    • High-Performance Digital Media System-on-Chip (DMSoC)
    • Up to 300-MHz ARM926EJ-S Clock Rate
    • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Supports a Range of Encode, Decode, and Video Quality Operations
    • Video Processing Subsystem
      • HW Face Detect Engine
      • Resize Engine from 1/16x to 8x
      • 16-Bit Parallel AFE (Analog Front-End) Interface Up to 120 MHz
      • 4:2:2 (8-/16-bit) Interface
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • Hardware On-Screen Display (OSD)
    • Capable of 720p 30fps H.264 video processing
      Note: 216-MHz is only capable of D1 processing
    • Peripherals include EMAC, USB 2.0 OTG, DDR2/NAND, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, Key Scan
    • 8 Different Boot Modes and Configurable Power-Saving Modes
    • Pin-to-pin and software compatible with DM368
    • Extended temperature (-40°C - 85°C) available for 300-Mhz device
    • 3.3-V and 1.8-V I/O, 1.2-V/1.35-V Core
    • 338-Pin Ball Grid Array at 65nm Process Technology
  • High-Performance Digital Media System-on-Chip (DMSoC)
    • 216-, 270-, 300-MHz ARM926EJ-S Clock Rate
    • Fully Software-Compatible With ARM9™
  • ARM926EJ-S™ Core
    • Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • DSP Instruction Extensions and Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT Logic for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • 32K-Byte RAM
    • 16K-Byte ROM
    • Little Endian
  • Two Video Image Co-processors (HDVICP, MJCP) Engines
    • Support a Range of Encode and Decode Operations
    • H.264, MPEG4, MPEG2, MJPEG, JPEG, WMV9/VC1
  • Video Processing Subsystem
    • Front End Provides:
      • HW Face Detect Engine
      • Hardware IPIPE for Real-Time Image Processing
        • Resize Engine
          • Resize Images From 1/16× to 8×
          • Separate Horizontal/Vertical Control
          • Two Simultaneous Output Paths
      • IPIPE Interface (IPIPEIF)
      • Image Sensor Interface (ISIF) and CMOS Imager Interface
      • 16-Bit Parallel AFE (Analog Front End) Interface Up to 120 MHz
      • Glueless Interface to Common Video Decoders
      • BT.601/BT.656/BT.1120 Digital YCbCr 4:2:2 (8-/16-Bit Module
      • Histogram Module
      • Lens distortion correction module (LDC)
      • Hardware 3A statistics collection module (H3A)
    • Back End Provides:
      • Hardware On-Screen Display (OSD)
      • Composite NTSC/PAL video encoder output
      • 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
      • 3 DACs for HD Analog Video Output
      • LCD Controller
      • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
  • Analog-to-Digital Convertor (ADC)
  • Power Management and Real Time Clock Subsystem (PRTCSS)
    • Real Time Clock
  • 16-Bit Host-Port Interface (HPI)
  • 10/100 Mb/s Ethernet Media Access Controller (EMAC) - Digital Media
    • IEEE 802.3 Compliant
    • Supports Media Independent Interface (MII)
    • Management Data I/O (MDIO) Module
  • Key Scan
  • Voice Codec
  • External Memory Interfaces (EMIFs)
    • DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)
    • Asynchronous16-/8-bit Wide EMIF (AEMIF)
      • Flash Memory Interfaces
        • NAND (8-/16-bit Wide Data)
        • 16 MB NOR Flash, SRAM
        • OneNAND(16-bit Wide Data)
  • Flash Card Interfaces
    • Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)
    • SmartMedia/xD
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • USB port with Integrated 2.0 High-Speed PHY that Supports
    • USB 2.0 High-Speed Device
    • USB 2.0 High-Speed Host (mini-host, supporting one external device)
    • USB On The Go (HS-USB OTG)
  • Four 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)
  • One 64-Bit Watch Dog Timer
  • Two UARTs (One fast UART with RTS and CTS Flow Control)
  • Five Serial Port Interfaces (SPI) each with two Chip-Selects
  • One Master/Slave Inter-Integrated Circuit (I2C) Bus™
  • One Multi-Channel Buffered Serial Port (McBSP)
    • I2S
    • AC97 Audio Codec Interface
    • S/PDIF via Software
    • Standard Voice Codec Interface (AIC12)
    • SPI Protocol (Master Mode Only)
    • Direct Interface to T1/E1 Framers
    • Time Division Multiplexed Mode (TDM)
    • 128 Channel Mode
  • Four Pulse Width Modulator (PWM) Outputs
  • Four RTO (Real Time Out) Outputs
  • Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • Boot Modes
    • On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, UART, USB, SPI, EMAC, or HPI
    • AEMIF (NOR and OneNAND)
  • Configurable Power-Saving Modes
  • Crystal or External Clock Input (typically 19.2 Mhz, 24 MHz, 27 Mhz or 36 MHz)
  • Flexible PLL Clock Generators
  • Debug Interface Support
    • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
    • ETB (Embedded Trace Buffer) with 4K-Bytes Trace Buffer memory
    • Device Revision ID Readable by ARM
  • 338-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch
  • 65nm Process Technology
  • 3.3-V and 1.8-V I/O, 1.2-V/ 1.35-V Internal
  • Community Reesources
    • TI E2E Community
    • TI Embedded Processors Wiki

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.

Windows is a trademark of Microsoft.

All other trademarks are the property of their respective owners.

參數(shù) 與其它產(chǎn)品相比 數(shù)字視頻處理器

 
Applications
Operating Systems
Arm CPU
Arm MHz (Max.)
DSP
DSP MHz
Video Acceleration
Video Resolution/Frame Rate
Video Port (Configurable)
USB
PCI/PCIe
EMAC
DRAM
SPI
I2C
UART (SCI)
On-Chip L2 Cache/RAM
Operating Temperature Range (C)
Pin/Package
TMS320DM365 TMS320DM368 TMS320DM369
Consumer Electronics
Industrial Cameras
Security
Video and Imaging
Portable Cameras
Video Surveillance IP Cameras    
Consumer Electronics
Industrial Cameras
Security
Video and Imaging
Portable Cameras
Video Surveillance IP Cameras    
Consumer Electronics
Industrial Cameras
Security
Video and Imaging
Portable Cameras
Video Surveillance IP Cameras    
Linux     Linux     Linux    
1 ARM9     1 ARM9     1 ARM9    
300     432     432    
0     0     0    
0     0     0    
1 MJCP
1 HDVICP    
1 MJCP
1 HDVICP    
1 MJCP
1 HDVICP    
720P
30 FPS    
1080P
30 FPS or Less    
1080P
30 FPS or less    
1 Dedicated Input
1 Dedicated Output    
1 Dedicated Input
1 Dedicated Output    
1 Dedicated Input
1 Dedicated Output    
USB2.0
HS
OTG    
USB2.0
HS
OTG    
USB2.0 HS OTG    
0     0     0    
10/100     10/100     10/100    
LPDDR
DDR2    
LPDDR
DDR2    
LPDDR
DDR2    
5     5     5    
1     1     1    
2     2     2    
0     0     0    
-40 to 85
0 to 85    
-40 to 85
0 to 85    
-40 to 85
0 to 85    
338NFBGA     338NFBGA     338NFBGA    

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