我們是AGM的長期授權代理商，可以為用戶提供最具競爭力的價格與技術支持服務。

功能替換  Altera Xilinx  Lattice MicroSemi FPGA：
AG10KSDE176

Altera：EP3C10 EP4CE10
Xilinx：XC3S400 XC6SLX9
Lattice：LFXP2-8E  LFE2-12SE
MicroSemi：M2S005 M2S010

AG10K(+MCU) SoC  AG10KSDE176

可以替代部分STM32F1XX的應用功能

FPGA+MCU SoC family device, integrates high performance FPGA logic with low-power MCU core in a single die one silicon, targets consumer and industrial's mass-volume market with low-cost and high-performance SoC. The device features integrated rich functions with 16K LUTs and MCU core with 250MHz.

MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. Cortex MCU, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.  Additionally,

Features

High-density architecture with 10K LEs

M9K embedded memory blocks, up to 414Kbits of RAM space

Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers

Provides 2 PLLs per device provide clock multiplication and phase shifting

High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL

Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL

General package options, LQFP-144, -176 and FBGA-256

Flexible device configuration through JTAG and SPI interface

Support remote update, by "dual-boot" like implementation

Packaging types include BGA256, and QFP144.

AG10KSDE176(+MCU)+SDRAM device is AG10KSDE176(+MCU) SoC bonded with 64MBit 32-bit 166MHz SDRAM die. EQFP-176 package is provided as industrial grade, is pin-to-pin compatible with AG16KSDE176(+MCU)+SDRAM.

MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. MCU core, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.

      AGM(遨格芯)2012年起步于僅是 FPGA IP 軟核和軟件授權公司, 2014年轉入芯片業務，CPLD芯片已經成熟，并且開始在行業有了一些應用，看到智能手機風口的AGM也不失時機出了一款用于智能手機和loT的FPGA芯片，并且通過了三星嚴格的供應商測試認證，成為三星Galaxy手機里除Lattice之外的唯一備選FPGA器件，實現了國內FPGA公司出口零的突破，具有特殊的戰略意義。

AGM在軟件和電路上擁有自主知識產權，在產品方面目前走的是兼容主流大廠并軟硬件生態不變的路線，在芯片內部接口兼容主流廠商器件，PCB板級可以直接替換并用AGM編譯軟件導入燒寫，AGM目前供貨器件可以直接替換：

CPLD系列，針對Altera MAX II系列，包括EPM240T100，EPM570T144，EPM570T100

低端FPGA SoC系列，針對Altera Cyclone III 系列FPGA：EP3C5E、EP3C5F、EP3C10E、EP3C10F、EP3C16F； Cyclone IV 系列FPGA：EP4CE6、EP4CE10、EP4CE15

高端FPGA SoC系列BlueWind，針對Xilinx Virtex系列。

以下是替代列表：

綠色料號，直接PINtoPIN，不需要重新畫板、打板，也不需要重新編程。

包裝規格：