TI公司的DRA71x系列是600 MHz ARM Cortex-A15 SoC處理器,其架構提供汽車應用時的高性能并行處理特性,包括圖像,語音,HMI,多媒體和智能手機投影模式功能,采用28-nm CMOS技術,支持全高清(HD)視頻(1920×1080p, 60 fps),多視頻輸入和視頻輸出以及2D和3D圖像,主要用在人機接口(HMI),導航,數字和模擬無線電,多媒體播放器,汽車顯示音頻系統,入門級導航和多媒體系統以及汽車數字儀表盤系統.本文介紹了DRA71x系列主要特性,框圖以及汽車信息娛樂系統參考設計TIDEP-0097主要特性和系統指標,框圖,電路圖和材料清單.
The DRA71x processor is offered in a 538-ball, 17×17-mm, 0.65-mm ball pitch (0.8mm spacing rules canbe used on signals) with Via Channel? Array (VCA) technology, ball grid array (BGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive applications in acost-effective solution, providing full scalability from the DRA75x (“Jacinto 6 EP ” and “ Jacinto 6 Ex”),DRA74x “Jacinto 6” and DRA72x “Jacinto 6 Eco” family of infotainment processors, including graphics,voice, HMI, multimedia and smartphone projection mode capabilities.
Programmability is provided by a single-core ARM Cortex-A15 RISC CPU with Neon? extensions and aTI C66x VLIW floating-point DSP core. The ARM processor lets developers keep control functionsseparate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexityof the system software.
Additionally, TI provides a complete set of development tools for the ARM, and DSP, including C compilers and a debugging interface for visibility into source code execution.The DRA71x Jacinto 6 Entry processor family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
DRA71x系列主要特性:
? Architecture Designed for InfotainmentApplications
? Video, Image, and Graphics Processing Support
– Full-HD Video (1920 × 1080p, 60 fps)
– Multiple Video Input and Video Output
– 2D and 3D Graphics
? ARM? Cortex?-A15 Microprocessor Subsystem
? C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x andC64x+
– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle
? Up to 512KB of On-Chip L3 RAM
? Level 3 (L3) and Level 4 (L4) Interconnects
? DDR3/DDR3L Memory Interface (EMIF) Module
– Supports up to DDR-1333 (667 MHz)
– Up to 2GB Across Single Chip Select
? Dual ARM? Cortex?-M4 Image Processing Units(IPU)
? IVA-HD Subsystem
? Display Subsystem
– Display Controller With DMA Engine and up toThree Pipelines
– HDMI? Encoder: HDMI 1.4a and DVI 1.0Compliant
? 2D-Graphics Accelerator (BB2D) Subsystem
– Vivante? GC320 Core
? Video Processing Engine (VPE)
? Single-Core PowerVR? SGX544 3D GPU
? One Video Input Port (VIP) Module
– Support for up to Four Multiplexed Input Ports
? General-Purpose Memory Controller (GPMC)
? Enhanced Direct Memory Access (EDMA)Controller
? 2-Port Gigabit Ethernet (GMAC)
– Up to Two External Ports
? Sixteen 32-Bit General-Purpose Timers
? 32-Bit MPU Watchdog Timer
? Six High-Speed Inter-Integrated Circuit (I2C) Ports
? HDQ?/1-Wire? Interface
? Ten Configurable UART/IrDA/CIR Modules
? Four Multichannel Serial Peripheral Interfaces(McSPI)
? Quad SPI Interface (QSPI)
? Media Local Bus Subsystem (MLBSS)
? Eight Multichannel Audio Serial Port (McASP)Modules
? SuperSpeed USB 3.0 Dual-Role Device
? High-Speed USB 2.0 Dual-Role Device
? High-Speed USB 2.0 On-The-Go
? Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces (MMC/SD/SDIO)
? PCI Express? 3.0 Subsystems With Two 5-GbpsLanes
– One 2-lane Gen2-Compliant Port
– or Two 1-lane Gen2-Compliant Ports
? Dual Controller Area Network (DCAN) Modules
– CAN 2.0B Protocol
? MIPI? CSI-2 Camera Serial Interface
? Up to 186 General-Purpose I/O (GPIO) Pins
? Power, Reset, and Clock Management
? On-Chip Debug With CTools Technology
? 28-nm CMOS Technology
? 17 mm × 17 mm, 0.65-mm Pitch, 538-Pin BGA(CBD)
DRA71x系列應用:
? Human-Machine Interface (HMI)
? Navigation
? Digital and Analog Radio
? Multimedia Playback
? Automotive Display Audio Systems
? Automotive Entry Navigation and MultimediaSystems
? Automotive Digital Cluster Systems
?
圖1.DRA71x系列框圖
汽車信息娛樂系統參考設計TIDEP-0097
This automotive reference design is based on TI’sJacinto? DRA71x processor and focuses on systemlevel cost savings.The six-layer design reduces PCBcosts through optimized via breakout scheme andpower distribution network as well as integration of keyfeatures. Functionality can be added or removedbased on the end product requirements. This designtargets applications such as infotainment andreconfigurable digital cluster. The design has a 12-Vinput with a single PMIC. The design supports HDMI,USB3.0 or USB2.0, TAS6424 digital Class-D amplifier,FPD-Link interface, and many other features. ALinux?, Android?, or QNX based softwaredevelopment kit (SDK) is included.
This reference design is a system that includes the DRA 71x automotive applications processor, a powersolution, DRAM(DDR3L), and multiple interface ports an expansion connectors. This system is designedon a six-layer PCB using a unique via breakout scheme, a single PMIC solution, and fewer but integratedfunctions that allows for lower manufacturing costs without sacrificing quality of the end product. Thereference design targets entry level infotainment applications with a high-end look and feel. An HDMI andFPD-Link III port allows for the connection of a high-definition display and rear view camera to provide arich user interface. A Bluetooth ? and Wi-Fi? module, audio and tuner inputs, and USB port are included toallow for connectivity of wireless and wired audio devices for rich output from the Class-D audio amplifier.The optimized power solution allows the design to be powered from a single 12-V power source.
參考設計TIDEP-0097主要特性:
? TI Jacinto DRA71x Processor With IntegratedFeatures Help Design Cost-Effective, Feature Rich,Entry Level (Display Audio) Infotainment andCluster Systems
? DRA71x Superset Processor With 2D and 3Dgraphics, C66x DSP, and Cortex?-M4 options
? Processor SDK for Linux, Android, and QNXDevelopment With Add-on Packages for Radio andAudio
? Cost Saving Features Include Six-Layer HWDesign, Rear View Camera (RVC) Support, TunerIntegration with Software Defined Radio(SDR),Class-D Amplifier and Multi-Sone Audio Support
? Includes TI ’ s Solution and Support for Power,Audio, Processing, and Display
參考設計TIDEP-0097應用:
? Entry Level In Vehicle Infotainment (IVI) Head Unit
? Digital Cluster
? Radio and Audio Co-processor
? Automotive Amplifier
圖2.參考設計TIDEP-0097外形圖
參考設計TIDEP-0097主要系統指標:
圖3.參考設計TIDEP-0097框圖
圖4.參考設計TIDEP-0097電路圖(1)
圖5.參考設計TIDEP-0097電路圖(2)
圖6.參考設計TIDEP-0097電路圖(3)
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圖9.參考設計TIDEP-0097電路圖(6)
圖10.參考設計TIDEP-0097電路圖(7)
圖11.參考設計TIDEP-0097電路圖(8)
圖12.參考設計TIDEP-0097電路圖(9)
圖13.參考設計TIDEP-0097電路圖(10)
圖14.參考設計TIDEP-0097電路圖(11)
圖15.參考設計TIDEP-0097電路圖(12)
圖16.參考設計TIDEP-0097電路圖(13)
圖17.參考設計TIDEP-0097電路圖(14)
圖18.參考設計TIDEP-0097電路圖(15)
圖19.參考設計TIDEP-0097電路圖(16)
圖20.參考設計TIDEP-0097電路圖(17)
圖21.參考設計TIDEP-0097電路圖(18)
圖22.參考設計TIDEP-0097電路圖(19)
圖23.參考設計TIDEP-0097電路圖(20)
圖24.參考設計TIDEP-0097電路圖(21)
圖25.參考設計TIDEP-0097電路圖(22)
圖26.參考設計TIDEP-0097電路圖(23)
圖27.參考設計TIDEP-0097電路圖(24)
參考設計TIDEP-0097材料清單:
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