1. 適用范圍RENESAS芯片支持情況.............................................................................1
2. 應用軟件界面簡介...................................................................................................4
3. 燒錄器件的步驟.......................................................................................................5
3.1 選擇器件...................................................................................................................5
3.2 將數(shù)據(jù)裝入緩沖區(qū)...................................................................................................6
3.3 設置芯片配置信息及加密選項...............................................................................7
3.4 編程芯片...................................................................................................................8
3.5 量產(chǎn)........................................................................................................................... 8
3.6 組合操作...................................................................................................................9
4. 脫機模式.................................................................................................................10
4.1 脫機操作說明.........................................................................................................10
4.1.1 鍵盤使用規(guī)則.....................................................................................................10
4.1.2 菜單介紹.............................................................................................................10
4.1.3 創(chuàng)建脫機工程.....................................................................................................10
4.2 脫機操作步驟......................................................................................................... 11
5. 免責聲明.................................................................................................................