--- 產品詳情 ---
Local sensor accuracy (Max) (+/- C) | 0.5 |
Type | Local |
Operating temperature range (C) | -40 to 125 |
Supply voltage (Min) (V) | 1.7 |
Interface type | I3C, I2C |
Supply voltage (Max) (V) | 1.98 |
Supply current (Max) (uA) | 9.1 |
Temp resolution (Max) (bits) | 11 |
Features | I3C, JEDEC JESD30201, Error Check |
Remote channels (#) | 0 |
Addresses | 2 |
Rating | Catalog |
- Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
- Exceeds JEDEC temperature accuracy specification:
- ±0.25 °C typical
- ±0.5 °C maximum (+75 °C to +95 °C)
- ±0.75 °C maximum (–40 °C to +125 °C)
- Operating temperature range: –40 °C to +125 °C
- Low power consumption:
- 8.3-μA typical average quiescent current
- 4.0-μA typical standby current
- I/O power supply of 1 V
- Core power supply of 1.8 V
- Two wire serial bus interface (I2C and I3C basic operation modes)
- Up to 12.5-MHz data transfer rate in I3C basic mode
- In Band Interrupt (IBI) for alerting host
- Parity error check function for host writes
- Packet error check function for host read and writes
- 11-bit resolution: 0.25 °C (1 LSB)
- Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch
The TMP139 is a high-accuracy temperature sensor with an I2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.
The TMP139 has a typical accuracy of ±0.25 °C over the entire temperature range from –40 °C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25 °C.
The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 μA when performing conversions every 125 ms.
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